Field-operable microconnections using automatically-triggered localized solder-bonding

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 403-406

  Lemmerhirt, David F ^a   Wise, Kensall D ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; MICROACTUATORS; MICROSENSORS; MICROSTRUCTURE; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; POLYIMIDES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON; SOLDERING; SUBSTRATES;

MICROCONNECTIONS; MICROSYSTEMS; SILICON SUBSTRATES;

MICROELECTROMECHANICAL DEVICES;

EID: 0036124233     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Directed locomotion in cockroaches: 'Biobots'
2. An ultralight biotelemetry backpack for recording EMG signals in moths
3. Localized bonding with PSG or indium solder as intermediate layer
4. Study of micro-scale limits of solder self-assembly for MEMS
5. Batch fabricated thin-film electrodes for simulation of the central auditory system
6. Flexible miniature ribbon cables for long-term connection to implantable sensors
7. Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist