Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 662-669

  Islam, M N ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Cu containing solder; Dissolution of electroless NiP; Intermetallics; Lead free solder

Indexed keywords

CORROSION; DISSOLUTION; ELECTROLESS PLATING; GOLD; INTERMETALLICS; METALLIZING; NICKEL COMPOUNDS; WETTING;

CU-CONTAINING SOLDERS; DISSOLUTION OF ELECTROLESS NIP; LEAD-FREE SOLDERS; MELTING TEMPERATURE;

SOLDERING ALLOYS;

EID: 20344376668     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0081-x     Document Type: Conference Paper

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