Environmental influence on adhesion of underfill with passivation materials

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 305-311

  Luo, S ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Aging; Coupling agent; Passivation; Underfill

Indexed keywords

CHIP SCALE PACKAGES; ENVIRONMENTAL IMPACT; GLASS TRANSITION; HYDROPHILICITY; PASSIVATION; POLYAMIDES; THERMAL CYCLING;

PASSIVATION MATERIALS;

ADHESION;

EID: 0034998530     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)