A curved-beam bistable mechanism

Journal of Microelectromechanical Systems

Volumn 13, Issue 2, 2004, Pages 137-146

  Qiu, Jin ^a   Lang, Jeffrey H ^b   Slocum, Alexander H ^c  

^a Tyco Electronics   (United States)

^b USA   (United States)

^c Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Beam analysis; Bistable structure; Compliant structure; Deep reactive ion etching (DRIE); Microelectromechanical systems (MEMS); Structure optimization

Indexed keywords

COMPUTER SIMULATION; ELECTRON DEVICE MANUFACTURE; ELECTRON DEVICE TESTING; FINITE ELEMENT METHOD; MECHANISMS; MODAL ANALYSIS; OPTIMIZATION; REACTIVE ION ETCHING; STRESSES;

BEAM ANALYSIS; CURVED BEAM BISTABLE MECHANISM; DEEP REACTIVE ION ETCHING; STRUCTURE OPTIMIZATION;

MICROELECTROMECHANICAL DEVICES;

EID: 1942500874     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.825308     Document Type: Article

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