Post-enabled flip-chip assembly for manufacturable RF-MEMS

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 1, Issue , 2003, Pages 829-832

  Faheem, F F ^a   Gupta, K C ^a   Lee, Y C ^a  

^a University of Colorado   (United States)

Author keywords

Assembly; Capacitance measurement; Capacitors; Circuit testing; Fabrication; Foundries; Manufacturing; Q factor; Radio frequency; Radiofrequency microelectromechanical systems

Indexed keywords

ACTUATORS; ASSEMBLY; CAPACITANCE; CAPACITANCE MEASUREMENT; CAPACITORS; CHIP SCALE PACKAGES; ELECTROMECHANICAL DEVICES; ELECTRONICS PACKAGING; FABRICATION; FOUNDRIES; MANUFACTURE; MEMS; MICROSYSTEMS; Q FACTOR MEASUREMENT; SOLID-STATE SENSORS; TRANSDUCERS;

CAPACITANCE RATIO; CAPACITIVE PERFORMANCE; CIRCUIT TESTING; FLIP CHIP ASSEMBLIES; Q-FACTORS; RADIO FREQUENCIES; RF PERFORMANCE; VARIABLE CAPACITOR;

FLIP CHIP DEVICES;

EID: 84944750808     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1215602     Document Type: Conference Paper

References (7)

1. MUMPs see http://www.memsrus.com
2. Z. Feng, H. Zhang, W. Zhang, B. Su, K. C. Gupta, V. M. Bright, and Y. C. Lee, "MEMS-Based variable Capacitor for Millimeter-Wave Applications," Proc. of the 2000 Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, USA, June 48, 2000, pp. 255-258.
3. N. Hoivik, Y.C. Lee and V.M. Bright, Flip-Chip Variable High-Q MEMS Capacitor for RF Applications, Proc. IPACK01, Kauai, Hawaii, USA, July 8-13, 2001.
4. V. Milanovic, M. Maharbiz, A. Singh, B.Warneke, N. Zhou, H.K. Chan, and K.S. Pfister, "Microrelays for batch transfer integration in RF systems," IEEE Int. Conf. MEMS, Tokyo, Japan, 787 (2001).
5. A. Laws, F. Faheem, H. Zhang, and Y. C. Lee, "Design Rules for MUMPs Tether Flip-Chip Bonded MEMS," to be presented at Proc. ASME Int. Mech. Engineering Congress and R&D Expo, November 15-21, 2003, Washington, D.C., USA.
6. P. J. Bell, N. Hoivik, V. M. Bright, and Z. Popović "Micro-Bias-Tees Using Micromachined Flip-Chip Inductors" to be presented at Microwave Symposium Digest, 2003 IEEE MTT-S International.
7. F.F. Faheem, N. D. Hoivik, Y.C. Lee, and K.C. Gupta, "Post-Enabled Precision Flip-Chip Assembly for Variable MEMS Capacitor" to be presented at Microwave Symposium Digest, 2003 IEEE MTT-S International.