Influence of thickness and dielectric properties on implantation efficacy in plasma immersion ion implantation of insulators

Journal of Applied Physics

Volumn 95, Issue 7, 2004, Pages 3319-3323

  Fu, Ricky K Y ^a   Chu, Paul K ^a   Tian, Xiubo ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DIELECTRIC PROPERTIES; ELECTRIC CONDUCTIVITY; ION IMPLANTATION; NITROGEN; PLASMA DENSITY; QUARTZ; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT;

PLASMA IMMERSION ION IMPLANTATION (PIII); PLASMA IRRADIATION;

PLASMA THEORY;

EID: 1942456817     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1666976     Document Type: Article

References (27)

1. C. Riccardi, R. Barni, E. Selli, G. Mazzone, M. R. Massafra, B. Marcandalli, and G. Poletti, Appl. Surf. Sci. 211, 386 (2003).
2. D. Ferrante, S. Iannace, and T. Monetta, J. Mater. Sci. 34, 175 (1999).
3. C. J. Jahagirdar and Y. Srivastava, J. Appl. Polym. Sci. 82, 292 (2001).
4. P. K. Chu, R. K. Y. Fu, X. C. Zeng, and D. T. K. Kwok, J. Appl. Phys. 90, 3743 (2001).
5. X. B. Tian, R. K. Y. Fu, L. W. Wang, and P. K. Chu, Mater. Sci. Eng., A 316, 200 (2001).
6. M. Ueda, C. M. Leipienski, E. C. Rangel, N. C. Cruz, and F. G. Dias, Surf. Coat. Technol. 156, 190 (2002).
7. R. K. Y. Fu, P. Peng, X. C. Zeng, D. T. K. Kwok, and P. K. Chu, IEEE Trans. Plasma Sci. 31, 156 (2003).
8. W. Moeller, S. Parascandola, T. Telbizova, R. Gunzel, and E. Richter, Surf. Coat. Technol. 136, 73 (2001).
9. X. B. Tian, R. K. Y. Fu, and P. K. Chu, J. Vac. Sci. Technol. A 20, 160 (2002).
10. P. K. Chu, S. Qin, C. Chan, N. W. Cheung, and L. A. Larson, Mater. Sci. Eng., R. R17, 207 (1996).
11. S. Qin, J. D. Bernstein, Z. F. Zhao, W. Liu, and C. Chan, J. Vac. Sci. Technol. B 13, 1994 (1995).
12. W. En, B. P. Linder, and N. W. Cheung, J. Vac. Sci. Technol. B 14, 552 (1996).
13. X. B. Tian, R. K. Y. Fu, J. Y. Chen, P. K. Chu, and I. G. Brown, Nucl. Instrum. Methods Phys. Res. B 187, 485 (2002).
14. A. Lacoste, F. Le Coeur, Y. Arnal, J. Pelletier, and C. Grattepain, Surf. Coat. Technol. 135, 268 (2001).
15. M. Tonosaki, H. Okita, Y. Takei, A. Chayahara, Y. Horino, and N. Tsubouchi, Surf. Coat. Technol. 136, 249 (2001).
16. R. K. Y. Fu, K. L. Fu, X. B. Tian, and P. K. Chu, J. Vac. Sci. Technol. A 22, 356 (2004).
17. M. A. Lieberman and A. J. Lichtenberg, Principles of Plasma Discharges and Materials Processing (Wiley, New York, 1994), p. 530.
18. J. T. Scheuer, M. Shamim, and J. R. Conrad, J. Appl. Phys. 67, 1241 (1990).
19. J. N. Matossian, R. W. Schumacher, and D. M. Pepper, U.S. Patent No. 5 374 456, Hughes Aircraft Company, Los Angeles, CA, 1994.
20. R. K. Y. Fu, X. B. Tian, and P. K. Chu, Rev. Sci. Instrum. 74, 3697 (2003).
21. D. L. Tang, R. K. Y. Fu, X. B. Tian, and P. K. Chu, Rev. Sci. Instrum. 74, 2704 (2003).
22. D. L. Tang and P. K. Chu, J. Appl. Phys. 93, 5883 (2003).
23. M. M. Shamim, J. T. Scheuer, R. P. Fetherston, and J. R. Conrad, J. Appl. Phys. 70, 4756 (1991).
24. X. B. Tian and P. K. Chu, J. Phys. D 34, 1639 (2001).
25. T. W. H. Oates, D. R. McKenzie, and M. M. M. Bilek, Surf. Coat. Technol. 156, 332 (2002).
26. G. J. H. Brussaard, M. van der Steen, M. Carrere, M. C. M. van de Sanden, and D. C. Schram, Surf. Coat. Technol. 98, 1416 (1998).
27. N. Hershkowitz, M. H. Cho, and J. Pruski, Plasma Sources Sci. Technol. 1, 87 (1992).