Influence of microstructure on the failure of eutectic solders

TMS Annual Meeting

Volumn , Issue , 1997, Pages 49-58

  Morris Jr , J W ^a   Reynolds, H L ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; MICROELECTRONICS; OPTOELECTRONIC DEVICES; SOLDERING ALLOYS;

MICROELECTRONIC SOLDER JOINTS;

MICROSTRUCTURE;

EID: 0031337614     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (31)