-
1
-
-
0037060168
-
Polymer microfluidic devices
-
Holger Becker, Laurie E.Locascio, Polymer microfluidic devices, Talanta, Vol.56, pp267-287, 2002.
-
(2002)
Talanta
, vol.56
, pp. 267-287
-
-
Becker, H.1
Locascio, L.E.2
-
2
-
-
0035280357
-
Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application
-
Duck-Jung Lee, Yun-Hi Lee, Jin Jang, Byeong-Kwon Ju, "Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application", Sensors and Actuators A, vol. 89, pp43-48, 2001
-
(2001)
Sensors and Actuators A
, vol.89
, pp. 43-48
-
-
Lee, D.-J.1
Lee, Y.-H.2
Jang, J.3
Ju, B.-K.4
-
3
-
-
2442562305
-
Micro fluidic channel fabrication by PDMS-interface bonding
-
Winnie W. Y. Chow, Kin Fong Lei, Guanyi Shi, Wen J. Li, and Qiang Huang, "Micro Fluidic Channel Fabrication by PDMS-Interface Bonding", Proc.SPIE, vol. 5275, pp141-148, 2004
-
(2004)
Proc. SPIE
, vol.5275
, pp. 141-148
-
-
Chow, W.W.Y.1
Lei, K.F.2
Shi, G.3
Li, W.J.4
Huang, Q.5
-
4
-
-
0034226179
-
Formation of silicon structures by plasma-activated wafer bonding
-
P. Amirfeiz,a S. Bengtsson, M. Bergh, E. Zanghellini and L. Börjesson, "Formation of Silicon Structures by Plasma-Activated Wafer Bonding", Journal of The Electrochemical Society, vol.147 (7), pp 2693-2698,2000
-
(2000)
Journal of the Electrochemical Society
, vol.147
, Issue.7
, pp. 2693-2698
-
-
Amirfeiz, P.1
Bengtsson, A.S.2
Bergh, M.3
Zanghellini, E.4
Börjesson, L.5
-
5
-
-
3142714380
-
Fusion bonding/welding of thermoplastic composites
-
Ali Yousefpour, Mehdi Hojjati, and Jean-Pierre Immarigeon, "Fusion Bonding/Welding of Thermoplastic Composites", Journal of Thermoplastic Composite materials, vol. 17, pp303-341, 2004
-
(2004)
Journal of Thermoplastic Composite Materials
, vol.17
, pp. 303-341
-
-
Yousefpour, A.1
Hojjati, M.2
Immarigeon, J.-P.3
-
6
-
-
0037373447
-
Thermal challenges in MEMS application: Phase change phenomena and thermal bonding process
-
Lin Liwei, "Thermal challenges in MEMS application: phase change phenomena and thermal bonding process", Microelectronics Journal, vol.34, pp179-185, 2003
-
(2003)
Microelectronics Journal
, vol.34
, pp. 179-185
-
-
Liwei, L.1
-
7
-
-
0033904174
-
Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging
-
Y. T. Cheng, Liwei Lin, "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging", J. Microelectromechanical System, vol. 9, pp3-8, 2000
-
(2000)
J. Microelectromechanical System
, vol.9
, pp. 3-8
-
-
Cheng, Y.T.1
Lin, L.2
-
8
-
-
18944404606
-
-
U.S.Patent No. 4636609
-
Nakamata et al.U.S.Patent No. 4636609.
-
-
-
Nakamata1
-
9
-
-
0035790694
-
Laser via generation into flexible substrates
-
IEEE, Session:9
-
Zsolt Illyefalvi-Vitéz, et.al., "Laser via generation into flexible substrates", IEEE, Session:9,Polymer Structure, pp230-235,2001
-
(2001)
Polymer Structure
, pp. 230-235
-
-
Illyefalvi-Vitéz, Z.1
-
10
-
-
0343210214
-
A passive micromixer: Threedimensional serpentine microchannel
-
Sendai, Japan
-
R. H. Liu, K. V. Sharp, M. G. Olsen, M. A. Stremler, J. G. Santiago, R. J. Adrian, H. Aref, and D. J. Beebe, "A passive micromixer: Threedimensional serpentine microchannel," in Proc. Transducers'99, Sendai, Japan, pp730-733, 1999
-
(1999)
Proc. Transducers'99
, pp. 730-733
-
-
Liu, R.H.1
Sharp, K.V.2
Olsen, M.G.3
Stremler, M.A.4
Santiago, J.G.5
Adrian, R.J.6
Aref, H.7
Beebe, D.J.8
-
11
-
-
0003214150
-
Novel interconnection technologies for integrated microfluidic systems
-
Hilton Head, SC
-
D. Jaeggi, B. L. Gray, N. J. Mourlas, B. P. Van Drieenhuizen, K. R. Williams, N. I. Maluf, and G. T. A. Kovacs, "Novel interconnection technologies for integrated microfluidic systems," in Solid State Sens. Actuators Conf., Hilton Head, SC, pp112-115, 1998
-
(1998)
Solid State Sens. Actuators Conf.
, pp. 112-115
-
-
Jaeggi, D.1
Gray, B.L.2
Mourlas, N.J.3
Van Drieenhuizen, B.P.4
Williams, K.R.5
Maluf, N.I.6
Kovacs, G.T.A.7
-
12
-
-
0032301392
-
Performance of MEMS based gas distribution and control systems for semiconductor processing
-
A. K. Henning, J. M. Herris, E. B. Arkilic, B. Cozad, and B. Dehan, "Performance of MEMS based gas distribution and control systems for semiconductor processing," Proc. SPIE, vol. 3514, pp59, 1998
-
(1998)
Proc. SPIE
, vol.3514
, pp. 59
-
-
Henning, A.K.1
Herris, J.M.2
Arkilic, E.B.3
Cozad, B.4
Dehan, B.5
-
13
-
-
0002830018
-
Photo-polymer microchannel technologies and applications
-
Banff, Canada, Oct.
-
P. Renaud, H. Van Lintel, M. Heuschkel, and L. Guerin, "Photo-polymer microchannel technologies and applications," in Process. uTAS'98, Banff, Canada, Oct., pp 17-21, 1998
-
(1998)
Process. UTAS'98
, pp. 17-21
-
-
Renaud, P.1
Van Lintel, H.2
Heuschkel, M.3
Guerin, L.4
-
14
-
-
0033876850
-
Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer
-
Byung-Ho Jo, Linda M. Van Lerberghe, Kathleen M. Motsegood, and David J. Beebe,Three-Dimensional Micro-Channel Fabrication in Polydimethylsiloxane (PDMS) Elastomer, J. MEMS, vol. 9,n1, pp76-81, 2000.
-
(2000)
J. MEMS
, vol.9
, Issue.1
, pp. 76-81
-
-
Jo, B.-H.1
Van Lerberghe, L.M.2
Motsegood, K.M.3
Beebe, D.J.4
-
15
-
-
0037438528
-
Fabrication of complex three-dimensional microchannel systems in PDMS
-
Hongkai Wu, Teri W. Odom, Daniel T. Chiu, and George M. Whitesides, "Fabrication of Complex Three-Dimensional Microchannel Systems in PDMS", J. AM. CHEM. SOC., vol. 125, pp554-559,2003
-
(2003)
J. Am. Chem. Soc.
, vol.125
, pp. 554-559
-
-
Wu, H.1
Odom, T.W.2
Chiu, D.T.3
Whitesides, G.M.4
-
16
-
-
0037586406
-
Use of infrared dyes for transmission laser welding of polymer
-
I.A.Jones, N.S.Taylor, R.Sallavanti, and J.Griffiths: "Use of Infrared Dyes for Transmission Laser Welding of Polymer", Proc. SPE 58th Annual Technical Conference, pp 1166-1170, 2000
-
(2000)
Proc. SPE 58th Annual Technical Conference
, pp. 1166-1170
-
-
Jones, I.A.1
Taylor, N.S.2
Sallavanti, R.3
Griffiths, J.4
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