Thermal challenges in MEMS applications: Phase change phenomena and thermal bonding processes

Microelectronics Journal

Volumn 34, Issue 3, 2003, Pages 179-185

  Lin, Liwei ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Bubble; Microelectromechanical systems; Phase change; Thermal bonding

Indexed keywords

BONDING; CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; NUCLEATION;

THERMAL BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0037373447     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(02)00186-6     Document Type: Conference Paper

References (30)

1. Lin L., Pisano A.P., Carey V.P. Thermal bubble formations on polysilicon micro resistors. ASME J. Heat Transfer. 120:(September):1998;735-742.
2. Tsai H. Jr., Lin L. Transient thermal bubble formation on polysilicon micro resistors. ASME J. Heat Transfer. 124:(2):2002;375-382.
3. Lin L., Pisano A.P. Thermal bubble powered microactuators. Microsyst. Technol. J. 1:(1):1994;51-58.
4. Tsai H. Jr., Lin L. A thermal bubble actuated micro nozzle-diffuser pump. IEEE/ASME J. Microelectromech. Syst. 11:2002;665-671.
5. Tsai H. Jr., Lin L. Active microfluidic mixer and gas bubble filter driven by thermal bubble micropump. Sens. Actuators, A. 97-98:2002;665-671.
6. Lin L., Cheng Y.T., Najafi K. Formation of silicon-gold eutectic bond using localized heating method. Jpn. J. Appl. Phys, Part II. 11B:(November):1998;1412-1414.
7. Cheng Y.T., Lin L., Najafi K. Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging. IEEE/ASME J. Microelectromech. Syst. 9:(March):2000;3-8.
8. Cheng Y.T., Lin L., Najafi K. A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding. IEEE/ASME J. Microelectromech. Syst. 10:(3):2001;392-399.
9. G.H. He, L. Lin, Y.T. Cheng, Localized CVD bonding for MEMS packaging, 10th International Conference on Solid State Sensors and Actuators, Transducer's 99, Technical Digest, Sendai, Japan, June 1999, pp. 1312-1315.
10. Luo C., Lin L. The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask. Sens. Actuators, A. 97-98:2002;398-404.
11. Koester D., Majedevan R., Shishkoff A., Marcus K. Multi-User MEMS Processes (MUMPS) Introduction and Design Rules, rev. 4. July 1996;MCNC MEMS Technology Applications Center, Research Triangle Park. NC 27709.
12. L. Lin, Selective encapsulations of MEMS: micro channels, needles, resonators and microelectromechanical filters, PhD Dissertation, Mechanical Engineering Department, University of California, Berkeley, 1993.
13. Lin L. Microscale thermal bubble formation: thermophysical phenomena and applications. Microscale Thermophys. Engng. 2:(2):1998;71-85.
14. Nielsen N.J. History of thinkjet printerhead development. HP J. 36:(5):1985;4-10.
15. Olsson A., Stemmme G., Stemme E. A valveless planar fluid pump with two pump chambers. Sens. Actuators, A. 46-47:1995;549-556.
16. M.J. Zdeblick, J.B. Angell, A microminiature electric-to-fluidic valve, International Conference on Solid State Sensors and Actuators, Transducer's 87, Technical Digest, 1987, pp. 827-829.
17. J.J. Sniegowski, A micro actuation mechanism based on liquid-vapor surface tension, International Conference on Solid State Sensors and Actuators, Transducer's 93, Late News Technical Digest, 1993, pp. 12-13.
18. Lin L., Udell K.S., Pisano A.P. Vapore bubble formation on a micro heater in confined and unconfined micro channels. Thermal Sci. Engng. 2:(1):1994;52-59.
19. T.K. Jun, C.-J. Kim, Microscale pumping with transversing bubbles in microchannels, Proceedings 1996 Solid-State Sensors and Actuators Workshop, Hilton Head, SC, 1996, pp. 144-147.
20. J. Evans, D. Liepmann, A.P. Pisano, Planar laminar mixer, Proceedings of IEEE Micro Electro Mechanical Systems Conference, January 1997, pp. 96-101.
21. H. Mizoguchi, M. Ando, T. Mizno, T. Takagi, N. Nakajima, Design and fabrication of light driven micropump, Proceedings of IEEE Micro Electro Mechanical Systems Conference, January 1992, pp. 31-36.
22. R.A. Braff, et al., A microbubble-powered bioparticle actuator, Solid-State Sensor and Actuator Workshop, Hilton Head, 2002, pp. 138-141.
23. M. Paranjape, et al., Dermal thermo-poration with a PDMS-based patch for transdermal biomolecular detection, Solid-State Sensor and Actuator Workshop, Hilton Head, 2002, pp. 73-76.
24. Wallis G., Pomerantz D. Filed assisted glass-metal sealing. J. Appl. Phys. 40:1969;3946-3949.
25. K.E. Peterson, P. Barth, et al., Silicon fusion bonding for pressure sensors, 1988 Solid-State Sensor and Actuator Workshop, Hilton Head, 1988, pp. 144-147.
26. J.J. Sniegowski, H. Guckel, R.T. Christenson, Performance characteristics of second generation polysilicon resonating beam force transducers, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, 1990, pp. 9-12.
27. L. Lin, R.T. Howe, A.P. Pisano, Microelectromechanical filters for signal processing, IEEE/ASME J. Microelectromech. syst. 7 (september) (1998) 286-294.
28. Lin L. MEMS Post-packaging by localized heating and bonding. IEEE Trans. Adv. Packag. 23:(November):2000;608-616.
29. Cheng Y.T., Lin L., Najafi K. A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding. IEEE/ASME J. Microelectromech. Syst. 10:(3):2001;392-399.
30. Cheng Y.T., Hsu W.T., Najafi K., Nguyen C.T., Lin L. Vacuum packaging technology using localized aluminum/silicon-to glass bonding. IEEE/ASME J. Microelectromech. Syst. 11:2002;556-565.