Laser via generation into flexible substrates

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 230-235

  Illyefalvi Vitéz, Zsolt ^a   Berényi, Richárd ^a   Gordon, Péter ^a   Pinkola, János ^a   Ruszinkó, Miklós ^a   Vanfleteren, Jan ^b  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON DIOXIDE LASERS; CHIP SCALE PACKAGES; INFRARED RADIATION; INSULATING MATERIALS; NEODYMIUM LASERS; POLYIMIDES; SUBSTRATES;

FLEXIBLE SUBSTRATES;

MICROELECTRONICS;

EID: 0035790694     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Belforte D. A., Archives August 1998 Back to basics: "Laser metal cutting", URL: http://www.laserfocusworld.com
2. Lerner E. J., "Carbon dioxide lasers deliver flexibility and power", Laser Focus World, Sep 1998, pp.131-137.
3. Harry J. E., "Ipari lézerek és alkalmazásuk", Muszaki Könyvkiadó, Budapest, 1979, pp.105-106, 140-149, 213
4. nd International Spring Seminar on Electronics Technology, Freital-Dresden (Germany), May 18-20, 1999, pp.307-310.
5. Series 48 Lasers, "Operation and Service Manual", SYNRAD Inc. 1998
6. 2 and Nd:YAG lasers for industrial applications", URL: http://plop.phys.cwru.edu/repairfaq/sam/laserco2.htm, December 1998.
7. th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Espoo, Finland, June 18-21, 2000, pp.289-295.
8. Illyefalvi-Vitéz,Zs.; Pinkola,J.; Ruszinkó,M.; Bojta,P.; Hertel,L.: New MCM-L Structure Applying Packageless Chip Size Devices and Laser Processed Board. The 33rd. International Symposium on Microelectronics (IMAPS 2000), Boston, Massachusetts (USA), September 20-22, 2000, pp.826-831.
9. Illyefalvi-Vitéz,Zs.: Laser processing for microelectronics packaging applications. Microelectronics Reliability, vol.41 (2001), pp.563-570.