-
1
-
-
0035971924
-
Microfabricated plastic chips by hot embossing methods and their applications for DNA separation and detection
-
G. B. Lee, S. H. Chen, G. R. Huang, W. C. Sung, and Y. H. Lin, "Microfabricated Plastic Chips by Hot Embossing Methods and Their Applications for DNA Separation and Detection", Sensors and Actuators B 75, pp. 142-148, 2001.
-
(2001)
Sensors and Actuators B
, vol.75
, pp. 142-148
-
-
Lee, G.B.1
Chen, S.H.2
Huang, G.R.3
Sung, W.C.4
Lin, Y.H.5
-
2
-
-
84944718707
-
Microwave bonding of polymer-based substrates for micro/nano fluidic applications
-
USA, June 8-11
-
th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers 03') Boston, USA, June 8-11, 2003.
-
(2003)
th International Conference on Solid-state Sensors, Actuators, and Microsystems (Transducers 03') Boston
-
-
Lei, K.F.1
Li, W.J.2
Budraa, N.3
Mai, J.D.4
-
3
-
-
0035277919
-
Low-temperature full wafer adhesive bonding
-
F. Niklaus, P. Enoksson, E. Kälvesten, and G. Stemme, "Low-temperature Full Wafer Adhesive Bonding", Journal of Micromechanics and Microengineering 11, pp. 100-107, 2001.
-
(2001)
Journal of Micromechanics and Microengineering
, vol.11
, pp. 100-107
-
-
Niklaus, F.1
Enoksson, P.2
Kälvesten, E.3
Stemme, G.4
-
4
-
-
0036466251
-
A Low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems
-
K. W. Oh, A. Han, S. Bhansali, and C. H. Ahn, "A Low-temperature Bonding Technique using Spin-on Fluorocarbon Polymers to Assemble Microsystems", Journal of Micromechanics and Microengineering 12, pp. 187-191, 2002.
-
(2002)
Journal of Micromechanics and Microengineering
, vol.12
, pp. 187-191
-
-
Oh, K.W.1
Han, A.2
Bhansali, S.3
Ahn, C.H.4
-
5
-
-
0141495420
-
Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8
-
S. Li, C. B. Freidhoff, R. M. Young, and R. Ghodssi, "Fabrication of Micronozzles using Low-temperature Wafer-level Bonding with SU-8", Journal of Micromechanics and Microengineering 13, pp. 732-738, 2003.
-
(2003)
Journal of Micromechanics and Microengineering
, vol.13
, pp. 732-738
-
-
Li, S.1
Freidhoff, C.B.2
Young, R.M.3
Ghodssi, R.4
-
6
-
-
0033876850
-
Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer
-
March
-
B. H. Jo, L. M. Van Lerberghe, K. M. Motsegood, and D. J. Beebe, "Three-Dimensional Micro-Channel Fabrication in Polydimethylsiloxane (PDMS) Elastomer", Journal of Microelectromechanical Systems, Vol. 9, No. 1, pp.76-81, March 2000.
-
(2000)
Journal of Microelectromechanical Systems
, vol.9
, Issue.1
, pp. 76-81
-
-
Jo, B.H.1
Van Lerberghe, L.M.2
Motsegood, K.M.3
Beebe, D.J.4
-
7
-
-
0032403465
-
Rapid prototyping of microfluidic systems in poly(dimethylsiloxane)
-
D. C. Duffy, J. C. McDonald, O. J. A. Schueller, and G. M. Whitesides, "Rapid Prototyping of Microfluidic Systems in Poly(dimethylsiloxane)", Analytical Chemistry, 70(23), pp.4974-4984, 1998.
-
(1998)
Analytical Chemistry
, vol.70
, Issue.23
, pp. 4974-4984
-
-
Duffy, D.C.1
McDonald, J.C.2
Schueller, O.J.A.3
Whitesides, G.M.4
-
8
-
-
0033988843
-
Fabrication of microfluidic systems in poly(dimethylsiloxane)
-
J. C. McDonald, D. C. Duffy, J. R. Anderson, D. T. Chiu, H. Wu, O. J. A. Schueller, and G. M. Whitesides, "Fabrication of Microfluidic Systems in Poly(dimethylsiloxane)", Electrophoresis, 21, pp. 27-40, 2000.
-
(2000)
Electrophoresis
, vol.21
, pp. 27-40
-
-
McDonald, J.C.1
Duffy, D.C.2
Anderson, J.R.3
Chiu, D.T.4
Wu, H.5
Schueller, O.J.A.6
Whitesides, G.M.7
-
9
-
-
50249152500
-
Effects of contact-stress on hot-embossed PMMA microchannel wall profile
-
Monterey, CA, USA, June 15-17
-
K. F. Lei, W. J. Li, and Y. Yam, "Effects of Contact-Stress on Hot-Embossed PMMA MicroChannel Wall Profile", High Aspect Ratio Micro-Structure Technology Workshop (HARMST) 2003, Monterey, CA, USA, June 15-17, 2003.
-
(2003)
High Aspect Ratio Micro-structure Technology Workshop (HARMST) 2003
-
-
Lei, K.F.1
Li, W.J.2
Yam, Y.3
|