Experimental evaluation of anodic bonding process using Taguchi method for maximum interfacial fracture toughness

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1998, Pages 318-321

  Go, Jeung Sang ^a   Cho, Young Ho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; BONDING; FRACTURE TOUGHNESS; INTERFACIAL ENERGY; STATISTICAL METHODS;

ANODIC BONDING PROCESS; TAGUCHI METHOD;

ELECTRONICS PACKAGING;

EID: 0031677502     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)