Thermal Characterization and Optimization of Active System IPEM

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 374, Issue 2, 2003, Pages 161-166

  Pang, Ying Feng ^a   Scott, Elaine P ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; ELECTRIC CONVERTERS; FINITE ELEMENT METHOD; INTEGRATION; MESFET DEVICES; MICROPROCESSOR CHIPS; OPTIMIZATION; PACKAGING; SEMICONDUCTING GALLIUM ARSENIDE; SILICON CARBIDE;

INTEGRATED POWER ELECTRONIC MODULES (IPEM); POWER CHIPS;

POWER ELECTRONICS;

EID: 1842482967     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-41415     Document Type: Conference Paper

References (10)

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