Extensive electrical and thermal characterization of an MCM-D technology

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 1, 2002, Pages 112-119

  Lozano, Manuel ^a   Santander, Joaquín ^a   Cabruja, Enric ^a   Collado, Ana ^a   Ullán, Miguel ^a   Lora Tamayo, Emilio ^a   Doyle, Rory ^b   McCarthy, Ger ^b   Barton, John ^b   Slattery, Orla ^b  

^a INSTITUTO DE MICROELECTRÓNICA DE BARCELONA   (Spain)

^b UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Bump bonding; Electrical test structures; Flipchip; MCM D; Multichip modules; Thermal analysis; Thermal modeling

Indexed keywords

CHARACTERIZATION; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; FLIP CHIP DEVICES; HEAT RESISTANCE; MULTILAYERS; RESISTORS; SEMICONDUCTING SILICON; SOLDERING; SUBSTRATES; THERMOANALYSIS;

BUMP BONDING; THERMAL CHARACTERIZATION;

MULTICHIP MODULES;

EID: 0036506058     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991183     Document Type: Article

References (10)

1. SUMMIT: Silicon substrate multichip modules for innovative products
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6. An experimental study of various cross sheet resistor test structures
7. Bridge and Van der Pauw sheet resistors for characterizing the line width of conducting layers
8. Accurate contact resistivity extraction on Kelvin structures with upper and lower resistive layers