Thermal characterization of packaged semiconductor device

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2000, Pages 220-226

  Feng, Shiwei ^a   Xie, Xuesong ^a   Lu, Changzhi ^a   Shen, Guangdi ^a   Gao, Guangbo ^a   Zhang, Xiaoling ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR LASERS; TEMPERATURE MEASUREMENT;

TEMPERATURE SENSITIVE PARAMETER (TSP);

MESFET DEVICES;

EID: 0033750703     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)