Thermal characterization of multi-die BGA packages

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 70-75

  Cote, K ^a   Langari, A ^a   Hashemi, H ^a  

^a Rockwell Semiconductor Systems ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ELECTRIC LOSSES; NETWORK COMPONENTS; PACKAGING; SOLDERED JOINTS; HEAT RESISTANCE; THERMAL EFFECTS;

DESIGN PARAMETERS; MULTIPLE DEVICES; POWER PLANES; SOLDERMASK THICKNESS; THEORETICAL STUDY; THERMAL CHARACTERIZATION; THERMAL DESIGNS; THERMAL PERFORMANCE;

BALL GRID ARRAYS; ELECTRONICS PACKAGING;

BALL GRID ARRAYS (BGA);

EID: 0031620362     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678673     Document Type: Conference Paper

References (4)

1. Lall, B. S., Guenin, B. M and Molnar, R. J., Methodology for Thermal Evaluation of Multichip Modules, Proc. Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 72-79, 1995.
2. Ortega, A., Moffat, R. J., The use of superposition in calculating cooling requirements for board mounted electronic components, Proc. electronics Components Conference., 32nd, pp. 133-144, 1982.
3. Kreith, F., Bohn, M. S., 1986, "Principles of Heat Transfer, " 4th edition, Harper & Row Publishers, New York, NY.
4. Incropera, F., Dewitt, P., 1990, "Fundamental of Heat Transfer, " 3rd edition, John Wiley & Sons, New York, NY. 1.