Thermal characterization of TBGA package for an integration in board level analysis

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 91-98

  Sansoucy, E ^a   Refai Ahmed, G ^b   Karimanal, K V ^c  

^a QUEEN S UNIVERSITY   (Canada)

^b Ceyba Inc   (Canada)

^c ANSYS INC   (United States)

Author keywords

Boundary conditions; Computational fluid dynamics; Electronics packaging; Heat transfer; Predictive models; Resistance heating; Solid modeling; Temperature; Thermal conductivity; Thermal resistance

Indexed keywords

BOUNDARY CONDITIONS; CHARACTERIZATION; COMPUTATIONAL FLUID DYNAMICS; ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT TRANSFER; RESISTORS; TEMPERATURE; THERMAL CONDUCTIVITY OF LIQUIDS; THERMAL CONDUCTIVITY OF SOLIDS;

BOARD-LEVEL SIMULATIONS; DIFFERENT BOUNDARY CONDITION; PREDICTIVE MODELS; RESISTANCE-HEATING; SOLID MODEL; THERMAL CHARACTERIZATION; THERMAL MODEL; TWO-RESISTORS;

THERMAL CONDUCTIVITY;

EID: 84903585742     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012443     Document Type: Conference Paper

References (11)

1. A. Bar-Cohen and W.B. Krueger, "Thermal Characterization of Chip Packages - Evolutionary Development of Compact Models," Thirteenth IEEE SEMI-THERM Symposium, pp. 180-197, 1997.
2. st Edition, 2000.
3. JC Characterization of Chip Packages - Justification, Limitations, and Future," IEEE CHMT Transactions, Vol. 12, No. 4 (December), pp. 724-731, 1989.
4. th IEEE Semi-Therm Symposium, pp. 40-48, 1997.
5. D. Boyalakuntla and J.Y. Murthy, "COBRA based compact models for simulation of electronic chip packages," Paper No: 15534, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 8-13, 2001, Kauai, Hawaii, USA.
6. S. R. Mathur, C. K. Lim, and R. Nair, "Development of a finite volume shell conduction model for complex geometries," Proceedings of the IMECE 2000, November 5-10, 2000, Orlando, Florida, USA.
7. K.V. Karimanal and G. Refai-Ahmed, "Compact Conduction Models (CCM) of Microelectronic Packages - A BGA Validation Study," to be presented at APACK 2001 conference on Advances in Packaging, 2001, Singapore.
8. K.V. Karimanal and G. Refai-Ahmed, "Validation of Compact Conduction Models of BGA Under Realistic Boundary Conditions," to be presented at ITHERM 2002, Eighth intersociety conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2002, San Diego.
9. "Icepak Version 3 Users Guide," Fluent Inc., Lebanon, New Hampshire, June 1999.
10. "A Users Guide to Electronic Package Macro Models and Accessories in Icepak," Fluent Inc., Lebanon, New Hampshire, 2001.
11. V. S. Arpaci and P.S. Larsen, Convection Heat Transfer, Prentice-Hall Inc., Englewood Cliffs, New Jersey, 1984.