Thermal characterization for a modular 3-D multichip module

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 277-282

  Fan, Mark S ^a   Plante, Jeannette ^a   Shaw, Harry ^a  

^a NASA GODDARD SPACE FLIGHT CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT LOSSES; HEAT RESISTANCE; MULTICHIP MODULES; SPACE FLIGHT;

COLUMN GRID ARRAY; METALLIC HEAT CONDUCTION PATH; OPTIMAL THERMAL PERFORMANCE;

THERMODYNAMICS;

EID: 0033709377     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)