Wafer bonding characteristics for 3C-SiC-on-insulator structures using PECVD oxide

Journal of the Korean Physical Society

Volumn 45, Issue 6, 2004, Pages 1557-1561

  Chung, Gwiy Sang ^a  

^a Dongseo University   (South Korea)

Author keywords

3c SiC; HF; MEMS; PECVD oxide; SiCOI; Wafer bonding

Indexed keywords

EID: 17544363897     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

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