A robust two-step etching process for large-scale microfabricated SiO 2 and Si3N4 MEMS membranes

Sensors and Actuators, A: Physical

Volumn 119, Issue 2, 2005, Pages 553-558

  Ni, Hai ^a   Lee, Hoo Jeong ^a   Ramirez, Ainissa G ^a  

^a Yale University   (United States)

Author keywords

EDP; Microelectromechanical system (MEMS); Microfabricated silicon dioxide silicon nitride membrane; Wet anisotropic etching

Indexed keywords

ANISOTROPY; ATOMIC FORCE MICROSCOPY; ETCHING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RATE CONSTANTS; SCANNING ELECTRON MICROSCOPY; SILICA; SILICON NITRIDE; SILICON WAFERS; SOLUTIONS; SURFACE ROUGHNESS;

MEME MEMBRANES; MICROELECTROMECHANICAL SYSTEMS (MEMS); MICROFABRICATED SILICON DIOXIDE; WET ANISOTROPIC ETCHING;

MICROELECTROMECHANICAL DEVICES;

EID: 17044427202     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.10.033     Document Type: Article

References (21)

1. R. Schellin, G. Hess, W. Kuhnel, C. Thielemann, D. Trost, J. Wacker, and R. Steinmann Measurements of the mechanical behavior of micromachined silicon and silicon-nitride membranes for microphones, pressure sensors and gas flow meters Sens. Actuators A41-42 1994 287 292
2. O. Tabata, K. Kawahata, S. Sugiyama, and I. Igarashi Mechanical property measurements of thin films using load-deflection of composite rectangular membranes Sens. Actuators A20 1989 135 141
3. I. George, P. Cemeli, B. Bonvalot, M. Wagener, A. Girard, A. Zarudiansky, and J. Suski Thin membranes with optimized thermomechanical properties for microsystem applications Sens. Actuators A46-47 1995 38 42
4. H.-J. Lee, and A.G. Ramirez Crystallization and phase transformations in amorphous NiTi thin film for microelectromechanical systems Appl. Phys. Lett. vol. 85 7 2004 1146 1148
5. N. Maluf An Introduction to Microelectromechanical Systems Engineering 2000 Artech House, Inc Norwood, MA
6. R.C. Jaeger second ed. Introduction to Microelectronic Fabrication vol.4 2002 Prentice Hall Upper Saddle River, NJ
7. M. Gad-el-Hak The MEMS Handbook 2002 CRC Press Boca Raton, FL
8. M.J. Madou Fundamentals of Microfabrication: The Science of Miniaturization second ed. 2002 CRC Press Boca Raton, FL
9. H. Tanaka, C. Yamashita, Y. Abe, M. Shikidan, and K. Sato Fast etching of silicon with a smooth surface in high temperature ranges near the boiling point of KOH solution Sens. Actuators A114 2004 516 520
10. I. Zubel, I. Barycka, K. Kotowska, and M. Kramkowska Silicon anisotropic etching in alkaline solutions IV the effect of organic and inorganic agents on silicon anisotropic etching process Sens. Actuators A87 2001 163 171
11. H. Tanaka, Y. Abe, T. Yoneyama, J. Ishikaa, O. Takenaka, and K. Inoue Effects of small amount of impurities on etching of silicon in aqueous potassium hydroxide solutions Sens. Actuators A82 2000 270 273
12. H. Camon, Z. Moktadir, and M. Djafari-Rouhani New trends in atomic scale simulation of wet chemical etching of silicon with KOH Mater. Sci. Eng. B37 1996 142 145
13. J. Chen, L. Liu, Z. Li, Z. Tan, Q. Jiang, H. Fang, Y. Xu, and Y. Liu Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation Sens. Actuators A96 2002 152 156
14. T. Baum, and D.J. Schiffrin AFM study of surface finish improvement by ultrasonic in the anisotropic etching of Si<1 0 0> in KOH for micromachining applications J. Micromech. Microeng. 7 1997 338 342
15. R. Iosub, C. Moldovan, and M. Modreanu Silicon membranes fabrication by wet anisotropic etching Sens. Actuators A99 2002 104 111
16. K. Sato, M. Shikida, T. Yamashiro, M. Tsunekawa, and S. Ito Roughening of single-srystal silicon surface etched by KOH water solution Sens. Actuators A73 1999 122 130
17. W. Dong, X. Zhang, C. Liu, M. Li, B. Xu, and W. Chen Mechanism for convex corner undercutting of (1 1 0) silicon in KOH Microelect. J. 35 2004 417 419
18. J. Tsaur, C. Du, and C. Lee Investigation of TMAH for front-side bulk micromachining process from manufacturing aspect Sens. Actuators A92 2001 375 383
19. J. Thong, P. Luo, W. Choi, and S. Tan Evolution of hillocks during silicon etching in TMAH J. Micromech. Microeng. 11 2001 61 69
20. B.R. Munson, D.F. Young, and T.H. Okiishi Fundamentals of Fluid Mechanics fourth ed. 2002 John Wiley & Sons New York
21. A.W. Adamson, and A.P. Gast Physical Chemistry of Surfaces sixth ed. 1997 John Wiley & Sons New York