Investigation of TMAH for front-side bulk micromachining process from manufacturing aspect

Sensors and Actuators, A: Physical

Volumn 92, Issue 1-3, 2001, Pages 375-383

  Tsaur, Jiunn Jye ^a   Du, Chen Hsun ^a   Lee, Chengkuo ^a  

^a Science Based Industrial Park   (Taiwan)

Author keywords

Anisotropic etching; Micromachining; Silicon; Taguchi method; TMAH

Indexed keywords

ADDITIVES; ALUMINUM; AMMONIUM COMPOUNDS; ANISOTROPY; COMPOSITION; ETCHING; MICROMACHINING; SEMICONDUCTING SILICON; SILICA; SOLUTIONS; SUBSTRATES; SURFACE STRUCTURE;

ANISOTROPIC ETCHING; FRONT SIDE BULK MICROMACHINING; TAGUCHI METHOD; TETRAMETHYL AMMONIUM HYDROXIDE;

MICROELECTRONIC PROCESSING;

EID: 0035425959     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00575-1     Document Type: Article

References (7)

1. Aluminum passivation in saturated TMAHW solutions for IC-compatible microstructures and device isolation
2. Effect of surfactant on surface quality of silicon microstructures etched in saturated TMAHW solutions
3. Anisotropic etching of silicon in TMAH solutions
4. pH-controlled TMAH etchants for silicon micromachining
5. Experimental investigation of high Si/Al selectivity during anisotropic etching in TMAH
6. TMAH/IPA anisotropic etching characteristics