Study and realisation of a micromechanical relay for use in a harsh environment

DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Volumn , Issue , 2003, Pages 108-112

  Conseil, F ^a   Derderian, P ^b   Ravat, M F ^b   Collard, D ^a   Buchaillot, L ^a  

^a Institut Superieur de l'Electronique et du Numerique   (France)

^b MBDA FRANCE   (France)

Author keywords

Analytical models; Contacts; Electrostatics; Integrated circuit reliability; Manufacturing processes; Micromechanical devices; Microrelays; Relays; Structural beams; Switches

Indexed keywords

EID: 1642631981     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2003.1287018     Document Type: Conference Paper

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