Mechanical reliability of silicon wafers with through-wafer vias for wafer-level packaging

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1783-1788

  Polyakov, A ^a   Bartek, M ^a   Burghartz, J N ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC ETCHING; ASPECT RATIO; PLASMA ETCHING; SILICON; SILICON WAFERS;

4-POINT BENDING; DESIGN RECOMMENDATIONS; FEM MODELLING; HIGH ASPECT RATIO; MECHANICAL CHARACTERISTICS; MECHANICAL RELIABILITY; THROUGH-WAFER VIAS; WAFER LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 1642584951     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00231-7     Document Type: Conference Paper

References (11)

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