IC-compatible two-level bulk micromachining process module for RF silicon technology

IEEE Transactions on Electron Devices

Volumn 48, Issue 8, 2001, Pages 1756-1764

  Pham, Nga Phuong ^b   Sarro, Pasqualina M ^a,b   Ng, Kiat T ^b   Burghartz, Joachim N ^a,b  

^a IEEE

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Crosstalk; Lithography; Microstrip; Microwave devices; RF transceiver; Silicon micromachining; Spiral inductor; Three dimensional integration

Indexed keywords

CROSSTALK; LITHOGRAPHY; MICROSTRIP LINES; MICROWAVE DEVICES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS; TRANSCEIVERS;

SILICON MICROMACHINING; SPIRAL INDUCTOR;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0035425126     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/16.936704     Document Type: Conference Paper

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