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Volumn , Issue , 2001, Pages 102-109
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Mechanical stability and handling-induced failure of micromachined wafers for RF applications
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Author keywords
Geometry; Mechanical variables measurement; Micromachining; Performance evaluation; Radio frequency; Radiofrequency identification; Silicon; Smoothing methods; Stability; Stress
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Indexed keywords
COMPOSITE MICROMECHANICS;
CONVERGENCE OF NUMERICAL METHODS;
FAILURE (MECHANICAL);
FRACTURE;
GEOMETRY;
INTEGRATED CIRCUITS;
MECHANICAL STABILITY;
MECHANICAL VARIABLES MEASUREMENT;
MICROMACHINING;
MONOLITHIC INTEGRATED CIRCUITS;
RADIO FREQUENCY IDENTIFICATION (RFID);
SILICON;
STRESSES;
CONVENTIONAL EQUIPMENT;
ENABLING TECHNOLOGIES;
MECHANICAL CHARACTERISTICS;
MECHANICAL FAILURES;
MICROMACHINED STRUCTURES;
PERFORMANCE EVALUATION;
RADIO FREQUENCIES;
SMOOTHING METHODS;
SILICON WAFERS;
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EID: 80054911959
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/SMIC.2001.942349 Document Type: Conference Paper |
Times cited : (4)
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References (16)
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