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Volumn 4557, Issue , 2001, Pages 312-319

Direct spray coating of photoresist for MEMS applications

Author keywords

Lithography for MEMS; Micromachining; Resist spray coating; RF MEMS

Indexed keywords

DEPOSITION; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SPRAYED COATINGS;

EID: 0035768057     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.442960     Document Type: Article
Times cited : (16)

References (9)
  • 1
    • 0034542586 scopus 로고    scopus 로고
    • IC-compatible process for pattern transfer in deep wells for integration of RF components
    • Santa Clara-USA, Sept. 18-10
    • N.P. Pham, P.M. Sarro, J.N. Burghartz, "IC-compatible process for pattern transfer in deep wells for integration of RF components", Proc. of the SPIE vol 4174, Santa Clara-USA, Sept. 18-10, 2000, pp. 390-397.
    • (2000) Proc. of the SPIE , vol.4174 , pp. 390-397
    • Pham, N.P.1    Sarro, P.M.2    Burghartz, J.N.3
  • 2
    • 0028125418 scopus 로고
    • Fabrication technology for wafer through-hole interconnections and three-dimensional stacks of chips and wafers
    • S. Linder, H. Baltes, F. Gnaedinger, E. Doering, S. Linder et al., "Fabrication technology for Wafer Through-Hole Interconnections and Three-Dimensional Stacks of Chips and Wafers", IEEE Proc. of MEMS 1994, pp. 349-354.
    • (1994) IEEE Proc. of MEMS , pp. 349-354
    • Linder, S.1    Baltes, H.2    Gnaedinger, F.3    Doering, E.4    Linder, S.5
  • 3
    • 84995728236 scopus 로고    scopus 로고
    • Electronic Vision at: http://www.EVGroup.com.
  • 4
    • 0010816705 scopus 로고    scopus 로고
    • Technical information, Clarian Corp
    • "AZA823 Photoresist", Technical information, Clarian Corp.
    • AZ4823 Photoresist
  • 5
    • 0032648263 scopus 로고    scopus 로고
    • Spray coating for MEMS, interconnects, and advanced packaging applications
    • July
    • T. Luxbacher and A. Mirza, "Spray Coating for MEMS, Interconnects, and Advanced Packaging Applications", SENSORS, Vol. 16, No. 7, pp. 61-64, July 1999.
    • (1999) SENSORS , vol.16 , Issue.7 , pp. 61-64
    • Luxbacher, T.1    Mirza, A.2
  • 9
    • 0010816114 scopus 로고    scopus 로고
    • Copper electroplating for integrated RF-devices
    • Nov 24-26, Mierlo, The Netherlands, ISBN: 90-73461-18-9
    • E. Boellard, J.N. Burghartz, C.I.M. Beenakker, "Copper electroplating for integrated RF-devices", Procs of SAFE 99, Nov 24-26, 1999, Mierlo, The Netherlands, ISBN: 90-73461-18-9.
    • (1999) Procs of SAFE 99
    • Boellard, E.1    Burghartz, J.N.2    Beenakker, C.I.M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.