Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems

Microelectronics Reliability

Volumn 44, Issue 2, 2004, Pages 251-258

  Tao, Yi ^a,b   Malshe, Ajay P ^a,b   Brown, William D ^a,b  

^a UNIVERSITY OF ARKANSAS   (United States)

^b 3202 Bell Engineering Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON DIOXIDE; ELECTROPLATING; ENCAPSULATION; HEATING; LASER APPLICATIONS; LOW TEMPERATURE EFFECTS; OPTIMIZATION; PACKAGING; SHOCK TESTING; SILICON; SOLDERED JOINTS; SOLDERING; SUBSTRATES; VACUUM APPLICATIONS;

MICROELECTROMECHANICAL SYSTEMS (MEMS); VACUUM PACKAGING;

MICROELECTRONICS;

EID: 0942277273     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00192-6     Document Type: Article

References (13)

1. Malshe A.P., O'Neal C., Singh S.B., Brown W.D., Eaton W.P., Miller W.M. Challenges in packaging of MEMS. Int. J. Microcirc. Electron. Packaging. 22(3):1999;233-241.
2. Madou M. Fundamentals of microfabrication. 1997;CRC Press, Boca Raton, FL. p. 382-393.
3. Budraa NK, Jackson HW, Barmatz M, Pike WT, Mai JD. Low pressure and low temperature hermetic wafer bonding using microwave heating. In: Proceedings of 12th International Workshop on Micro Electro Mechanical Systems, 1999. p. 490-2.
4. Tao Yi, Malshe AP, Brown WD. Laser bonding and modeling for wafer-level and chip-scale vacuum packaging of MEMS. In: Proceedings of ASME 2002 International Mechanical Engineering Congress and Exposition, New Orleans, Louisiana, USA, 17-22 November 2002.
5. Chiao M., Lin L. Hermetic wafer bonding based on rapid thermal processing. Sens. Actuat. (Phys.) A. 91(3):2001;398-402.
6. Luo Cheng, Lin Liwei, Chiao Mu. Nanosecond-pulsed laser bonding with a built-in mask for MEMS packaging applications. In: Proceedings of the 11th International Conference on Solid-State Sensors and Actuators, Munich, Germany, 10-14 June 2001.
7. Mescheder UM, Alavi M, Hiltmann K, Lizeau Ch, Nachtigall Ch, Sandmaier H. Local laser bonding for low temperature budget. In: Proceedings of the 11th International Conference on Solid-State Sensors and Actuators, Munich, Germany, 10-14 June 2001.
8. Wild M.J., Gillner A., Poprawe R. Advances in silicon to glass bonding with laser. Proc. SPIE. 4407:2001;35-141.
9. Howlader MMR, Watanabe T, Suga T. Bonding of p-Si/n-InP wafers through surface activated bonding method at room temperature. In: Proceedings of 2001 International Conference on Indium Phosphide and Related Materials, 13th IPRM, 2001. p. 272-5.
10. Marinis TF, Fulginiti DA, Clausen HG. Packaging MEM sensor arrays. In: Proceedings of Materials Research Society Symposium, 605, 2000. p. 177-82.
11. Rapp D. Thermo-optical properties of silicon. Available from: http://www.gps.caltech.edu/genesis/Thermal-Coll.html [References therein].
12. Department of Defense, Test Method Standard, Micro-circuits, Method 1014.9, March 14, 1995.
13. Department of Defense, Test Method Standard, Micro-circuits, Method 1011.9, March 14, 1995.