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Volumn 4700, Issue , 2002, Pages 274-278

Vacuum packaging of microresonators by rapid thermal processing

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; MICROMACHINING; POLYSILICON; SILICON NITRIDE; THERMAL EFFECTS; VACUUM APPLICATIONS;

EID: 0036028815     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.475039     Document Type: Article
Times cited : (6)

References (8)
  • 4
    • 0035880220 scopus 로고    scopus 로고
    • Hermetic wafer bonding based on rapid thermal processing
    • M. Chiao and L. Lin, "Hermetic wafer bonding based on rapid thermal processing," Sensors and Actuators A-Physical 91, pp. 398-402, 2001.
    • (2001) Sensors and Actuators A-Physical , vol.91 , pp. 398-402
    • Chiao, M.1    Lin, L.2
  • 7
    • 0002609575 scopus 로고    scopus 로고
    • Using video microscopy to characterize micromechanics of biological and man-made micromachines
    • June
    • D.M. Freeman and C.Q. Davis, "Using video microscopy to characterize micromechanics of biological and man-made micromachines," in Technical Digest of Solid-State sensor and actuator workshop, pp. 161-167, June 1996.
    • (1996) Technical Digest of Solid-State sensor and actuator workshop , pp. 161-167
    • Freeman, D.M.1    Davis, C.Q.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.