Sensitivity study of temperature and strain rate dependent properties on solder joint fatigue life

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 184-189

  Pang, H L J ^a   Wang, Y P ^a   Shi, X Q ^a   Wang, Z P ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN; TENSILE TESTING; THERMAL CYCLING; THERMOANALYSIS;

PLASTIC BALL GRID ARRAY (PBGA) PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032230570     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)