Sample Preparation for Backside Failure Analysis Using Infrared Photoemission Microscopy

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 117-124

  Trigg, Alastair ^a   Yong, Loh Peak ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b DEPARTMENT OF ELECTRONICS AND COMPUTER ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; FAILURE ANALYSIS; GRINDING WHEELS; IMAGE ANALYSIS; INFRARED RADIATION; INTEGRATED CIRCUITS; MICROSCOPIC EXAMINATION; OPTICAL FILTERS; OPTIMIZATION; PHOTOEMISSION; SEMICONDUCTOR DOPING;

BACKSIDE FAILURE ANALYSIS; INFRARED PHOTOEMISSION MICROSCOPES (IRPEM);

SILICON WAFERS;

EID: 1542330849     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. D T Hurley, "High Speed Diamond Based Machining of Silicon Semiconductor Die in Wafer and Packaged Form for Backside Emission Microscopy Detection", US Patent No 5698474 December 1997.
2. C Chiang, N Khurana, D T Hurley & K Teasdale, "Backside Emission Microscopy for Integrated Circuits on Heavily Doped Substrate", Proceedings of 24th International Symposium on Testing & Failure Analysis 447 - 453, 1998.
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8. J C Sturm & C M Reeves, "Silicon Temperature Measurement by Infrared Absorption: Fundamental Processes and Doping Effects", IEEE Transaction Electron Devices 39(1), 81-88, 1992.
9. S P Roberts & J M Patterson, "A Study of Effects of Backside Thinning on Integrated Circuits using a Precision Diamond Wheel Apparatus", Proceedings of the 24th International Sym-posium for Testing and Failure Analysis, 441 - 445, 1998.