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Volumn , Issue , 1998, Pages 441-445
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A Study of Effects of Backside Thinning on Integrated Circuits Using a Precision Diamond Wheel Apparatus
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Author keywords
[No Author keywords available]
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Indexed keywords
BACKSIDE THINNING;
FAULT ISOLATION TOOLS;
CHEMICAL POLISHING;
CLAMPING DEVICES;
DIAMOND CUTTING TOOLS;
ELECTRONICS PACKAGING;
GRINDING WHEELS;
IMAGE QUALITY;
INTEGRATED CIRCUITS;
INTERCONNECTION NETWORKS;
MOUNTINGS;
SCANNING ELECTRON MICROSCOPY;
STAINLESS STEEL;
THICKNESS MEASUREMENT;
TRANSMISSION ELECTRON MICROSCOPY;
FAILURE ANALYSIS;
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EID: 0345041371
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (3)
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