Failure Analysis from Back Side of Die

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1996-November, Issue , 1996, Pages 393-399

  Wu, N M ^a   Weaver, K ^a   Lin, J H ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS;

ANALYSIS APPROACH; DE-CAPSULATION; EMISSION MICROSCOPY; FAULT ISOLATION; FINDING ROOTS; ISOLATION TECHNIQUES; OPTICAL BEAM INDUCED CURRENTS; REAL PROBLEMS; ROOT CAUSE OF FAILURES; SIDE EMISSION;

DIES;

EID: 85124087662     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1996p0393     Document Type: Conference Paper

References (4)

1. Yang Edward, Microelectronic Devices, McGraw-Hill Publishing Company, 1988.
2. T.W. Joseph, A.L. Berry, and B. Bossmann, Infrared laser microscopy of structures on heavily doped silicon, ISTFA, 1992, pp. 1-7.
3. Wallinger T, Characterization of Device Structure by Spectral Analysis of Photoemission, ISTFA, 1991, pp. 325-334.
4. Hiroyasu Ishizuka, et. al., Advanced Method of Failure Analysis Using Photon Spectrum of Emission Microscopy, ISTFA, 1990, pp. 13-19.