Backside Emission Microscopy for Integrated Circuits on Heavily Doped Substrate

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1998, Pages 447-453

  Chiang, C ^a   Khurana, N ^a   Hurley, D T ^a   Teasdale, K ^b  

^a Hypervision Inc   (United States)

^b Hexfet America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSIDE EMISSION MICROSCOPY; ELECTROSTATIC DISCHARGE (ESD); EMISSION MICROSCOPY (EM);

CHARGE COUPLED DEVICES; CHEMICAL POLISHING; COMPUTER SOFTWARE; DOPING (ADDITIVES); ENERGY GAP; IMAGE QUALITY; IMAGING TECHNIQUES; INFRARED RADIATION; LIGHT ABSORPTION; SILICON;

INTEGRATED CIRCUITS;

EID: 0345041382     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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