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Volumn 3215, Issue , 1997, Pages 101-108

In-line testing of antenna-type test structures for separation of sources of process-induced damage

Author keywords

Antenna test structures; Gate oxide breakdown; In line testing; Plasma charging; Plasma enhanced CVD; Process induced damage

Indexed keywords

ANTENNA TEST STRUCTURES; CHARGING DAMAGES; GATE OXIDE BREAKDOWN; GATE OXIDE INTEGRITIES; IN-LINE TESTING; INDUCED CHARGING; MOS TRANSISTORS; OXIDE DEPOSITIONS; OXIDIZED SILICON WAFERS; PLASMA CHARGING; PLASMA PROCESSING; POTENTIAL SOURCES; PROCESS COMPLEXITIES; SALICIDATION; SUBSEQUENT ANALYSES; SURFACE CHARGE ANALYSIS; TYPE TESTS;

EID: 1542284779     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284672     Document Type: Conference Paper
Times cited : (4)

References (14)
  • 1
    • 0030711972 scopus 로고    scopus 로고
    • ESD Protection Design and Applications to Bidirectional Antenna Protection for Sub-5 nm Gate Oxides
    • A. Amerasekera and S. Krishnan, "ESD Protection Design and Applications to Bidirectional Antenna Protection for Sub-5 nm Gate Oxides", Proc. 2nd Int Symp. Plasma Process-Induced Damage, pp. 33-37, 1997
    • (1997) Proc. 2nd Int Symp. Plasma Process-Induced Damage , pp. 33-37
    • Amerasekera, A.1    Krishnan, S.2
  • 2
    • 0026929133 scopus 로고
    • Process-Induced Gate Oxide Charge Collector Damage
    • W. M. Greene and C. K. Lau, "Process-Induced Gate Oxide Charge Collector Damage", J. Elecrochem. Soc., 139, No. 10, pp. 2948-2952, 1992.
    • (1992) J. Elecrochem. Soc , vol.139 , Issue.10 , pp. 2948-2952
    • Greene, W.M.1    Lau, C.K.2
  • 4
    • 0028460611 scopus 로고    scopus 로고
    • Y. D. Chan, Using SEMATECH Electrical Test Structures in Assessing Plasma Induced Damage in Poly Etching, J. Jpn. Appl. Phys. (Part 1), No. 7B, pp. 334458-60, 1994.
    • Y. D. Chan, "Using SEMATECH Electrical Test Structures in Assessing Plasma Induced Damage in Poly Etching", J. Jpn. Appl. Phys. (Part 1), , No. 7B, pp. 334458-60, 1994.
  • 5
    • 0029239294 scopus 로고
    • Use of SPIDER for the Identification and Analysis of Process Induced Damage in 0.35 μm Transistors
    • P. Aum et al., "Use of SPIDER for the Identification and Analysis of Process Induced Damage in 0.35 μm Transistors", Proc. Int. Conf. on Microel. Test Structures, pp. 1-4, 1995.
    • (1995) Proc. Int. Conf. on Microel. Test Structures , pp. 1-4
    • Aum, P.1
  • 7
    • 0029332398 scopus 로고
    • Low Temperature Chemical Vapor Deposition Processes and Dielectrics for Microelectronic Circuit Manufacturing at IBM
    • D. R. Cotte et al., "Low Temperature Chemical Vapor Deposition Processes and Dielectrics for Microelectronic Circuit Manufacturing at IBM", IBM Journal Res. Develop., 39, No. 4, pp. 437-464, 1994.
    • (1994) IBM Journal Res. Develop , vol.39 , Issue.4 , pp. 437-464
    • Cotte, D.R.1
  • 8
    • 4243131158 scopus 로고
    • Plasma Damage of Gate Oxide Through the Interlayer Dielectric
    • S. Hirao et al., "Plasma Damage of Gate Oxide Through the Interlayer Dielectric", Ext. Abstracts Int. Conf. Solid State Dev. Mat., pp. 826-828, 1993.
    • (1993) Ext. Abstracts Int. Conf. Solid State Dev. Mat , pp. 826-828
    • Hirao, S.1
  • 9
    • 0029404693 scopus 로고
    • Control of Plasma Damage to Gate Oxide During High Densisty Plasma Chemical Vapor Deposition
    • S. Botra, C. T. Gabriel, S. Lassig, and D. Pirkle, "Control of Plasma Damage to Gate Oxide During High Densisty Plasma Chemical Vapor Deposition", J. Electrochem. Soc., 142, No. 11, pp. L208-211, 1995.
    • (1995) J. Electrochem. Soc , vol.142 , Issue.11
    • Botra, S.1    Gabriel, C.T.2    Lassig, S.3    Pirkle, D.4
  • 10
    • 0030420870 scopus 로고    scopus 로고
    • J. Lagowski et al. A Novel Method for Studying Degradation Related to Plasma Processing of Silicon Wafers, Mat. Res. Soc. Symp. Proc., 428 Materials Reliability in Microelectronics, pp. 437-442, 1996.
    • J. Lagowski et al. "A Novel Method for Studying Degradation Related to Plasma Processing of Silicon Wafers", Mat. Res. Soc. Symp. Proc., vol. 428" Materials Reliability in Microelectronics", pp. 437-442, 1996.
  • 12
    • 0029322184 scopus 로고
    • Charging Damage from Plasma Enhanced TEOS Deposition
    • K. P. Cheung and C.-S. Pai "Charging Damage from Plasma Enhanced TEOS Deposition", IEEE Electron Dev. Lett., 16, No. 6, pp. 220-222, 1995.
    • (1995) IEEE Electron Dev. Lett , vol.16 , Issue.6 , pp. 220-222
    • Cheung, K.P.1    Pai, C.-S.2
  • 13
    • 0030672457 scopus 로고    scopus 로고
    • Sporadic Charging in Interlevel Oxide Deposition in Conventional Plasma and HDP Deposition Systems
    • T. Hook, A. Stamper, D. Armbrust, "Sporadic Charging in Interlevel Oxide Deposition in Conventional Plasma and HDP Deposition Systems", Proc. 2nd Int Symp. Plasma Process-Induced Damage, pp. 149-152, 1997.
    • (1997) Proc. 2nd Int Symp. Plasma Process-Induced Damage , pp. 149-152
    • Hook, T.1    Stamper, A.2    Armbrust, D.3
  • 14
    • 0030172381 scopus 로고    scopus 로고
    • Temperature Accelerated Gate Oxide Degradation Under Plasma-Induced Charging
    • T. Brozek, Y. D. Chan, and C. R. Viswanathan, "Temperature Accelerated Gate Oxide Degradation Under Plasma-Induced Charging", IEEE Electron Dev. Lett., 17, No. 6, pp. 288-290, 1996.
    • (1996) IEEE Electron Dev. Lett , vol.17 , Issue.6 , pp. 288-290
    • Brozek, T.1    Chan, Y.D.2    Viswanathan, C.R.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.