A microfabrication process for a vacuum-encapsulated microchamber

Microelectronic Engineering

Volumn 77, Issue 3-4, 2005, Pages 412-419

  Randolph, Steven J ^a   Hale, Mark D ^b   Guillorn, Michael A ^c   Rack, Philip D ^a   Simpson, Michael L ^a,b  

^a University of Tennessee Knoxville   (United States)

^b UNIVERSITY OF TENNESSEE   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

Field emission; Microchamber; Microelectromechanical systems; Microencapsulation; Microfabrication; Thin film processing; Vacuum encapsulation

Indexed keywords

ATMOSPHERIC PRESSURE; CURRENT VOLTAGE CHARACTERISTICS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; PRESSURE EFFECTS; THIN FILMS; TUNGSTEN; VACUUM;

FIELD EMISSION; MICROCHAMBERS; MICROENCAPSULATION; MICROFABRICATION; THIN FILM PROCESSING; VACCUM ENCAPSULATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 15344348578     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.02.003     Document Type: Article

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