Design and implementation of system-on-package for radio and mixed-signal applications

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 97-104

  Zheng, Li Rong ^a   Duo, Xingzhong ^a   Shen, Meigen ^a   Torrika, Tommi ^a   Michielsen, Wim ^a   Tenhunen, Hannu ^a   Chen, Liu ^b   Zou, Gang ^b   Liu, Johan ^b  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SOFTWARE; COST BENEFIT ANALYSIS; LIQUID CRYSTAL POLYMERS; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS; PRINTED CIRCUIT DESIGN; WIRELESS TELECOMMUNICATION SYSTEMS;

SYSTEM-ON-PACKAGE (SOP) TECHNOLOGY; WIRELESS BODY AREA NETWORKS (WBAN); WIRELESS INTEGRATION; WIRELESS LINKS;

CHIP SCALE PACKAGES;

EID: 14844333278     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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9. th ECTC Conference.
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