Fatigue crack initiation in solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 2, 1996, Pages 41-44

  Zhang, Z ^a   Yao, Daping ^a   Shang, L K ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD ALLOYS; STRAIN; STRESSES; TIN ALLOYS;

BACKFACE STRAIN; LAP JOINTS;

SOLDERED JOINTS;

EID: 0030172688     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792129     Document Type: Article

References (14)

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