Ruthenium Bottom Electrode Prepared by Electroplating for a High Density DRAM Capacitor

Journal of the Electrochemical Society

Volumn 151, Issue 2, 2004, Pages

  Kwon, Oh Joong ^a   Cha, Seung Hwan ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AUGER ELECTRON SPECTROSCOPY; CHEMICAL ACTIVATION; CLEANING; DYNAMIC RANDOM ACCESS STORAGE; ELECTRODES; ELECTROPLATING; FABRICATION; RUTHENIUM; SURFACE ROUGHNESS; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTRODE FABRICATION;

CAPACITORS;

EID: 1242309975     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1637900     Document Type: Article

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