Submicrometer Platinum Electrodes by Through-Mask Plating

Journal of the Electrochemical Society

Volumn 148, Issue 11, 2001, Pages

  Saenger, K L ^a   Costrini, G ^b   Kotecki, D E ^c   Kwietniak, K T ^a   Andricacos, P C ^a,d  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

^c UNIVERSITY OF MAINE   (United States)

^d ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005254158     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1410971     Document Type: Article

References (6)

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2. P. C. Andricacos, J. H. Comfort, A. Grill, D. E. Kotecki, V. V. Patel, K. L. Saenger, and A. G. Schrott, U.S. Pat. 5,789,320 (1998).
3. H. Horii, B. T. Lee, H. J. Lim, S. H. Joo, C. S. Kang, C. Y. Yoo, H. B. Park, W. D. Kim, S. I. Lee, and M. Y. Lee, in Proceedings of the 1999 Symposium on VLSI Technology, p. 103 (1999).
4. C. Y. Yoo, H. B. Park, D. S. Hwang, H. Hideki, W. D. Kim, H. J. Lim, Y. W. Park, S. I. Lee, and M. Y. Lee, Mater. Res. Soc. Symp. Proc., 596, 11 (2000).
5. Handbook of Chemisny and Physics, 67th ed., R. C. Weast, Editor, CRC, Boca Raton, FL (1986).
6. S. P. Murarka, Silicides for VLSI Applications, Academic Press, New York (1983).