Reducing warpage of printed circuit boards by using wavy traces

Journal of Electronic Packaging

Volumn 126, Issue 3, 2004, Pages 282-287

  Hutapea, Parsaoran ^a   Grenestedt, Joachim L ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTICITY; ENVIRONMENTAL CHAMBERS; FINITE ELEMENT METHOD; PRINTED CIRCUIT MANUFACTURE; STIFFNESS; STRAIN GAGES; THERMAL EXPANSION; VIBRATIONS (MECHANICAL);

ELASTIC STIFFNESS; ELECTRIC TRACES; WARPAGE; WAVY TRACES;

PRINTED CIRCUIT BOARDS;

EID: 12344317137     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1756591     Document Type: Article

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