Tuning of electric artworks of printed circuit boards to reduce warpage

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 9, Issue , 2004, Pages 230-234

  Hutapea, Parsaoran ^a   Grenestedt, Joachim L ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FINITE ELEMENT METHOD; ITERATIVE METHODS; OPTIMIZATION; SEMICONDUCTOR DEVICE MODELS; THERMAL EXPANSION; TUNING;

ELECTRIC ARTWORKS; FINITE ELEMENT (FE) MODELING; ISOTHERMAL WARPAGE; MINIATURIZED ELECTRONICS; ORGANIC SUBSTRATES;

PRINTED CIRCUIT BOARDS;

EID: 2442536991     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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8. P. Hutapea, J. L. Grenestedt, "Effect of Temperature on Elastic Properties of Woven Glass Epoxy Composites for Printed Circuit Board Applications," Journal of Electronic Material, 32(4), pp.221-227, 2003.
9. Y. Stavsky, N. J. Hoff, Composite Engineering Laminates. Edited by A. G. H. Dietz, MIT Press, Cambridge, MA, 1969.