Using waviness to reduce thermal warpage in printed circuit boards

Applied Physics Letters

Volumn 81, Issue 21, 2002, Pages 4079-4081

  Grenestedt, Joachim L ^a   Hutapea, Parsaoran ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CROSSTALK; DEFORMATION; DEGREES OF FREEDOM (MECHANICS); FINITE ELEMENT METHOD; SOLDERED JOINTS;

THERMAL WARPAGE;

PRINTED CIRCUIT BOARDS;

EID: 0037132195     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1523635     Document Type: Article

References (6)

1. L.W. Ritchey, Printed Circ. Design 17, 26 (2000).
2. T.-W. Chou and K. Takahashi, Composites 18, 25 (1987).
3. C.-M. Kuo, K. Takahashi, and T.-W. Chou, J. Compos. Mater. 22, 1004 (1988).
4. A.L. Highsmith, J.J. Davis, and K.L.E. Helms, Composite Materials: Testing and Design, edited by G.C. Grimes (ASTM, Philadelphia, PA, 1992), Vol. 10, pp. 20-36.
5. H.M. Hsiao and I.M. Daniel, Composites: Part A 27, 931 (1996).
6. J.L. Grenestedt, J. Mech. Phys. Solids 46, 29 (1998).