Effect of temperature on elastic properties of woven-glass epoxy composites for printed circuit board applications

Journal of Electronic Materials

Volumn 32, Issue 4, 2003, Pages 221-227

  Hutapea, Parsaoran ^a   Grenestedt, Joachim L ^a  

^a Lehigh University   (United States)

Author keywords

In plane shear moduli; Out of plane shear moduli; Printed circuit boards; Temperature effect on elastic properties; Vibration method; Woven glass epoxy substrates; Young's moduli

Indexed keywords

DAMPING; ELASTIC MODULI; GLASS; GLASS TRANSITION; STIFFNESS; THERMAL EFFECTS;

WOVEN-GLASS EPOXY COMPOSITES;

PRINTED CIRCUIT BOARDS;

EID: 0037392079     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0213-0     Document Type: Article

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