Thermoelastic properties of plain weave composites for multilayer circuit board applications

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 1, 1999, Pages 37-43

  Sottos, N R ^a   Ockers, J M ^a   Swindeman, M ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; EPOXY RESINS; MATHEMATICAL MODELS; OPTICAL MICROSCOPY; POISSON RATIO; THERMOELASTICITY;

MULTILAYER CIRCUIT BOARDS; PLAIN WEAVE COMPOSITES; THERMAL MECHANICAL ANALYSIS (TMA);

ELECTRONICS PACKAGING;

EID: 0033098259     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792659     Document Type: Article

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