Towards a better understanding of underfill encapsulation for flip chip technology: Proposed developments for the future

Microelectronics International

Volumn 16, Issue 2, 1999, Pages 39-43

  Gilleo, Ken ^a   Witt, Matthew ^b   Blumel, David ^a   Ongley, Peter ^b  

^a Alpha Metals Inc   (United States)

^b Alpha Microlectron Packaging Mat   (United Kingdom)

Author keywords

Chip scale packaging; Encapsulation; Flip chip; Polymerization; Thermoplastics; Underfill

Indexed keywords

EID: 0006083525     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369910268268     Document Type: Article

References (7)

1. Pascarella, N. and Baldwin, D., "Compression flow modeling of underfill encapsulants for low cost flip chip assembly", 48th ECTC, Seattle, WA, May 1998, pp. 463-70.
2. Baldwin, D. and Pascarella, N., "Manufacturability of underfill processing for low cost flip chip". ASME International Congress and Expo, Dallas, TX, November 1997.
3. Han, S., Wang, K. and Cho, S., "Experimental and analytical study on the flow of encapsulant during underfill encapsulation of flip-chips", Proc 46th Electronic Component and Technology Conf., Orlando, FL, May 1996, pp. 327-34.
4. Pascarella, N. and Baldwin, D., "Advanced encapsulation processing for low cost electronics assembly - a cost analysis", 3rd International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, GA, March 1997, pp. 50-3.
5. Pascarella, N. and Baldwin, D., "Advanced encapsulation processing for low cost electronics assembly - a cost analysis", Advances in Electronic Packaging - ASME INTERpack '97, Vol. 19 No. 1, June 1997, pp. 359-63.
6. Ito, S. et al., "A novel flip chip technology using non-conductive resin sheet", 48th Electronic Components and Technology Conference, Seattle, WA, May 1998, pp. 1047-51.
7. Gilleo, K. et al., "Thermoplastic die attach adhesive for today's packaging challenges". Electronic Packaging and Production, February, 1994, pp. 109-12.