Experimental and analytical study on large passivation opening to improve solder joint reliability for micro SMD packages

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 223-228

  Arora, Vivek ^a   Zhang, Li ^a   Nguyen, Luu ^a   Kelkar, Nikhil ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; NUMERICAL METHODS; PASSIVATION; RELIABILITY; SILICON WAFERS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

ALUMINUM BUMP PAD; MICRO SURFACE MOUNT DEVICE PACKAGE; UNDER BUMP METAL; WAFER LEVEL-CHIP SCALE PACKAGE;

CHIP SCALE PACKAGES;

EID: 0036451829     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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