Finite element based solder joint fatigue life predictions for a same die size - Stacked - Chip scale - Ball grid array package

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 274-284

  Zahn, Bret A ^a  

^a ChipPAC Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; RELIABILITY; SOLDERED JOINTS; THERMAL EFFECTS; VISCOPLASTICITY;

BALL GRID ARRAY PACKAGE; SOLDER FATIGUE; STACKED DIE; SYSTEM IN A PACKAGE;

CHIP SCALE PACKAGES;

EID: 0036396985     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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