Mechanical bend fatigue reliability of lead-free PBGA assemblies

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 915-918

  Jonnalagadda, Krishna ^a   Patel, Mahesh ^a   Skipor, Andrew ^a  

^a MOTOROLA INC   (United States)

Author keywords

Bend fatigue; Lead free; Reliability

Indexed keywords

BENDING (DEFORMATION); FATIGUE OF MATERIALS; RELIABILITY; TIN ALLOYS;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0036459787     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Japanese Ministry of Health and Welfare Waste Regulation on Un-Reusable Pb, June 1998.
2. European Union Waste in Electrical and Electronic Equipment (WEEE) Directive, 3rd Draft, May 2000.
3. Lead Free Solder Project Final Report, NCMS Report 0401RE96, August 1997.
4. Charles Zhang, Jong-Kai Lin, and Li Li, "Thermal Fatigue Properties of Lead-free Solders on Cu and NiP Under Bump Metallurgies", IEEE-ECTC, May 2001.
5. Andrew Mawer, Plastic Ball Grid Array, Motorola Semiconductor Technical Data, Document No. AN1231/D.
6. Andrew Skipor and Larry Leicht, "Mechanical Cycling Fatigue of PBGA Package Interconnects," Int'l J. of Microcircuits and Electronic Packaging, Vol. 22, No. 1, pp. 43-48, 1999.
7. Krishna Jonnalagadda. "Via-in-pad Reliability in Mechanical Cycling Fatigue", Proceedings of IMAPS 33rd International Symposium on Microelectronics, pp. 716-721 September 20-22nd, 2000.
8. P. Vianco, A. Fossum, M. Neilsen, S. Burchett, Constitutive Model Development for Predicting Thermal Mechanical Fatigue Deformation in Solder Interconnects, IPC Workshop, 2000.
9. Hareesh Mavoori and Jason Chin, "Reliability, Lifetime Prediction and Accelerated Testing of Prospective Alternatives to Lead Based Solders", IEEE Transactions, 1995.
10. Andrew Skipor and Larry Leicht, "Mechanical Bending Fatigue Reliability and Its Application to Area Array Packaging," ECTC, Orlando Florida. May 2001.
11. Krishna Jonnalagadda. "Thermal and Bending Fatigue of PBGA Assemblies with Lead-Free Solder Pastes", Proceedings of IMAPS 34th International Symposium on Microelectronics, Baltimore, October 9-11th, 2001.