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Applied Physics A: Materials Science and Processing

Volumn 80, Issue 3, 2005, Pages 597-600

Electroless gold deposition on silicon(100) wafer based on a seed layer of silver

(4) Jing, F a Tong, H a Kong, L a Wang, C a

a LANZHOU UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDITY; ATOMIC FORCE MICROSCOPY; ELECTROLESS PLATING; GOLD; OXIDES; PASSIVATION; SILVER; SOLUTIONS; SURFACE PROPERTIES;

ELECTROLESS BATH; ELECTROLESS GOLD DEPOSITION; SEED LAYERS; SELF-PASSIVATING OXIDES;

SILICON WAFERS;

EID: 10844291703 PISSN: 09478396 EISSN: None Source Type: Journal
DOI: 10.1007/s00339-003-2236-z Document Type: Article

Times cited : (28)

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