Evaluation of substrate (Ni)-catalyzed electroless gold plating process

Journal of the Electrochemical Society

Volumn 147, Issue 3, 2000, Pages 1059-1064

  Osaka, T ^a   Misato, T ^a   Sato, J ^a   Akiya, H ^a   Homma, T ^a   Kato, M ^a   Okinaka, Y ^a   Yoshioka, O ^b  

^a WASEDA UNIVERSITY   (Japan)

^b HITACHI CABLE LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; COMPOSITION EFFECTS; ELECTROLESS PLATING; METALLIC FILMS; NICKEL; OXIDES; PH; POROSITY; SUBSTRATES; TEMPERATURE;

AUTOCATALYTIC ELECTROLESS GOLD PLATING; GALVANIC DISPLACEMENT PROCESS; GOLD FILMS;

GOLD;

EID: 0033907732     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393313     Document Type: Article

References (11)

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